亚洲AI算力产业与数据中心液冷技术展 (Asia AI Computing Power Industry & Data Center Liquid Cooling Technology Exhibition)
Exhibition Overview
Floor Plan & Exhibitors
Official floor plan and exhibitor resources are being verified.
Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: 亚洲AI算力产业与数据中心液冷技术展 (Asia AI Computing Power Industry & Data Center Liquid Cooling Technology Exhibition)
- Edition year: 2026
- Dates: 2026-11-26 to 2026-11-28
- Location: Shenzhen, China
- Venue: 深圳国际会展中心 (宝安馆)
- Organizer: 深圳振威国际展览有限公司 (Zhenwei Exhibition Group)
- Industry: AI computing infrastructure and data center cooling
- Frequency: Annual
- Official website: http://asia-cpdc.com/
- Verification: verified
The 2026 edition positions itself as a specialized platform for exploring the intersection of AI-driven compute density and advanced thermal management solutions in the Chinese market.
Hosting the exhibition in Shenzhen allows participants to engage directly with the epicenter of the Great Bay Area's high-tech manufacturing and digital infrastructure ecosystem.
Zhenwei Exhibition Group provides a professional organizational framework for navigating the rapidly evolving landscape of data center cooling technologies and AI hardware requirements.
Attending the November 2026 event offers a timely opportunity to evaluate technical shifts in infrastructure support for AI workloads ahead of the next calendar year's strategic planning.
Opportunity types
Who exhibits
- Liquid cooling solution providers
- Data center infrastructure manufacturers
- AI hardware integration firms
Who visits
- Data center operators
- AI cloud service providers
- IT infrastructure procurement managers
Shenzhen is widely regarded as a critical hub for global electronics manufacturing and sustainable digital infrastructure development. As AI compute demands surge, the regional market has become a focal point for innovations in power efficiency and cooling technologies for large-scale data facilities.
Reviewed: October 26, 2026
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Sources
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