2027第三届北京国际AI算力与数据中心、液冷技术展
Exhibition Overview
Floor Plan & Exhibitors
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Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: 2027第三届北京国际AI算力与数据中心、液冷技术展
- Edition year: 2027
- Dates: 2027-03-18 to 2027-03-20
- Location: Beijing, China
- Venue: 中国国际展览中心-老馆
- Industry: 通信物联
- Frequency: annual
- Verification: verified
The 2027 Beijing exhibition provides a specialized platform to evaluate current advancements in AI computing infrastructure and liquid cooling hardware.
Attendees can directly observe emerging technical standards and integration solutions relevant to the rapidly evolving data center sector in China.
The event facilitates professional networking within the localized Beijing communication and IoT ecosystem, supporting supply chain alignment for upcoming capital projects.
Opportunity types
Who exhibits
- Data center cooling solution providers
- AI hardware manufacturers
- IT infrastructure developers
Who visits
- Data center facility managers
- Cloud service procurement teams
- Telecommunications network engineers
Beijing remains a strategic hub for high-tech industrial development in China, increasingly focusing on the integration of AI computing power with energy-efficient cooling solutions. The shift toward higher density data centers continues to drive local demand for specialized hardware and infrastructure compliance.
Reviewed: October 26, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 20, 2026