2026第三十二届集成电路设计业展览会
Exhibition Overview
Floor Plan & Exhibitors
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Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: 2026第三十二届集成电路设计业展览会
- Edition year: 2026
- Dates: 2026-11-19 to 2026-11-20
- Location: Beijing, China
- Venue: 北京亦创国际会展中心
- Industry: 通信物联
- Verification: verified
The 2026 edition serves as a strategic meeting point in Beijing to evaluate the latest advancements in integrated circuit design tailored for communication and IoT ecosystems.
Attending provides a direct window into the hardware-software integration trends emerging from China's capital, a primary hub for northern high-tech development.
The scheduling of this event in November 2026 allows stakeholders to align their design cycles and procurement strategies with the industry's annual progress in semiconductor architecture.
Opportunity types
Who exhibits
- IC design companies
- Semiconductor IP providers
- IoT module manufacturers
- EDA tool developers
Who visits
- System integrators
- Electronic component procurement managers
- Semiconductor technical analysts
- Network infrastructure architects
Beijing remains a vital center for integrated circuit design, benefiting from strong proximity to national research institutions and a dense concentration of hardware technology enterprises. As communication protocols continue to evolve, regional market players are increasingly focused on localizing core design capabilities for IoT applications.
Reviewed: October 23, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 21, 2026