2027第九届全球半导体产业（重庆）博览会
Exhibition Overview
Floor Plan & Exhibitors
Official floor plan and exhibitor resources are being verified.
Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: 2027第九届全球半导体产业（重庆）博览会
- Edition year: 2027
- Dates: 2027-05-12 to 2027-05-14
- Location: Chongqing, China
- Venue: 重庆国际博览中心
- Industry: 通信物联
- Verification: verified
The 2027 edition provides a strategic window to engage with Chongqing's rapidly expanding semiconductor and communication ecosystem during its ninth iteration.
Attending at the Chongqing International Expo Center allows for direct observation of regional technology integration trends in the evolving communications and IoT landscape.
The May 2027 event timing facilitates mid-year commercial planning for participants looking to navigate the semiconductor supply chain in Western China.
Professional presence at this specific expo offers a platform for exploring the intersection of industrial IoT and semiconductor advancements supported by the regional economic development of Chongqing.
Opportunity types
Who exhibits
- Semiconductor chip manufacturers
- IoT communication module providers
- Integrated circuit design firms
- Electronic component suppliers
Who visits
- Industrial IoT system integrators
- Supply chain procurement managers
- Semiconductor technology analysts
- Telecommunications infrastructure developers
Chongqing is increasingly recognized as a vital manufacturing hub for high-tech industries and electronic components in Western China. The city's investment in digital infrastructure continues to draw industry players focused on semiconductor application and IoT connectivity.
Reviewed: October 26, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 21, 2026