第四届中国西部半导体及集成电路产业博览会暨“两链”融合创新发展论坛 / 中国(西安)电子信息产业博览会
Exhibition Overview
Floor Plan & Exhibitors
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Why Attend
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Based on verified event data
- Event: 第四届中国西部半导体及集成电路产业博览会暨“两链”融合创新发展论坛 / 中国(西安)电子信息产业博览会
- Edition year: 2026
- Dates: 2026-09-10 to 2026-09-12
- Location: 西安, China
- Venue: 西安国际会展中心
- Organizer: 上海超博展览有限公司、中国西部半导体及集成电路产业博览会组委会、中国(西安)电子信息产业博览会组委会
- Industry: 计算机通信及电子设备
- Official website: www.xibubdt.com
- Verification: verified
This edition has already concluded; the analysis below is retained for reference.
The 2026 event focused on the integration of the semiconductor industrial and innovation chains within the strategically significant Xi'an electronics hub.
The exhibition served as a professional platform for regional stakeholders to evaluate the latest advancements in semiconductor and integrated circuit manufacturing technologies.
The forum component facilitated industry discussions regarding the development of the electronic information ecosystem in Western China during the 2026 cycle.
The event offered a retrospective view of the local supply chain capacity by gathering core components, materials, and equipment providers at the Xi'an International Convention and Exhibition Center.
Opportunity types
Who exhibits
- Semiconductor equipment manufacturers
- Integrated circuit design firms
- Electronic component suppliers
Who visits
- Industry research analysts
- Supply chain managers
- Electronic product manufacturers
Xi'an serves as a critical node for China's inland electronics manufacturing, benefiting from substantial research and development resources in the semiconductor sector. The region continues to attract investment as a strategic alternative to coastal hubs for advanced integrated circuit development.
Reviewed: October 23, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 22, 2026