2027深圳国际AI算力产业展览会<br/>2027第10届深圳国际数据中心液冷技术展览会
Exhibition Overview
Floor Plan & Exhibitors
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Why Attend
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Based on verified event data
- Event: 2027深圳国际AI算力产业展览会<br/>2027第10届深圳国际数据中心液冷技术展览会
- Edition year: 2027
- Dates: 2027-06-16 to 2027-06-18
- Location: Shenzhen, China
- Venue: 深圳国际会展中心(宝安)
- Organizer: 博寒展览(深圳)有限公司 、深圳励悦展览有限公司
- Official website: www.lcs-expo.com
- Verification: verified
The 2027 edition serves as a localized hub for the intersection of high-performance AI computing requirements and the rapidly evolving liquid cooling infrastructure necessitated by modern data centers.
Attending provides a focused window into how Shenzhen-based manufacturers are integrating cooling solutions directly with hardware architectures to support large-scale AI deployment.
The Shenzhen International Convention and Exhibition Center location facilitates direct technical dialogue with regional firms positioned at the forefront of the data center supply chain.
This event offers a platform to observe the technical evolution of the 10th iteration of this specialized data center cooling exhibition in a market characterized by high-density compute innovation.
Opportunity types
Who exhibits
- Liquid cooling system manufacturers
- Data center infrastructure providers
- AI hardware integrators
- Thermal management component suppliers
Who visits
- Data center operations managers
- Compute hardware procurement specialists
- Infrastructure research engineers
- System integration consultants
Shenzhen remains a vital node in global technology manufacturing, increasingly shifting its focus toward high-density AI infrastructure and energy-efficient data center operations. As compute demands scale, the industry is seeing a strategic move toward advanced thermal management to ensure operational sustainability.
Reviewed: October 26, 2026
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Sources
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Last checked: October 22, 2026