半導体・センサ パッケージング技術展
Exhibition Overview
Floor Plan & Exhibitors
Official floor plan and exhibitor resources are being verified.
Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: 半導体・センサ パッケージング技術展
- Edition year: 2027
- Dates: 2027-02-17 to 2027-02-19
- Location: Tokyo, Japan
- Venue: 東京ビッグサイト
- Organizer: RX Japan 合同会社
- Industry: Manufacturing Industry
- Official website: https://www.nepconjapan.jp/tokyo/ja-jp/about/isp.html
- Verification: verified
The 2027 exhibition at Tokyo Big Sight offers a dedicated venue for observing technical advancements in semiconductor and sensor packaging technologies.
Attendees can evaluate the latest integration and manufacturing solutions hosted by RX Japan, specifically curated for the industrial electronics supply chain.
The February 2027 timing provides an early-year opportunity to assess emerging material and assembly trends directly from Japan's core manufacturing technology hub.
Opportunity types
Who exhibits
- Semiconductor packaging material suppliers
- Assembly equipment manufacturers
- Sensor component producers
Who visits
- Electronics product engineers
- Manufacturing supply chain managers
- R&D procurement officers
Tokyo remains a pivotal node in the global semiconductor ecosystem, reflecting Japan's long-standing focus on precision engineering and high-end component manufacturing. The current industrial landscape emphasizes the miniaturization and increased functionality of sensors, making specialized forums essential for navigating evolving technical standards.
Reviewed: October 27, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 27, 2026