プリント配線板 EXPO
Exhibition Overview
Floor Plan & Exhibitors
Official floor plan and exhibitor resources are being verified.
Why Attend
The points below are MESSE5 analysis generated from verified event data and industry context. They are not organizer claims; attendance or outcomes are not guaranteed.
Based on verified event data
- Event: プリント配線板 EXPO
- Edition year: 2027
- Dates: 2027-02-17 to 2027-02-19
- Location: Tokyo, Japan
- Venue: 東京ビッグサイト
- Organizer: RX Japan 合同会社
- Industry: Manufacturing Industry
- Official website: https://www.nepconjapan.jp/tokyo/ja-jp/about/pwb.html
- Verification: verified
The 2027 edition provides a centralized platform to evaluate the latest advancements in printed circuit board manufacturing technologies within the Tokyo industrial hub.
Engaging with the 2027 exhibition allows participants to observe the current development trajectory of Japanese electronic component production processes.
The event facilitates direct assessment of emerging fabrication techniques and materials essential for modern manufacturing chains in the Asia-Pacific region.
Attending the Tokyo Big Sight venue in February 2027 offers a timely opportunity to examine technical upgrades ahead of the fiscal year's hardware development cycle.
Opportunity types
Who exhibits
- PCB manufacturers
- Electronic component suppliers
- Manufacturing equipment providers
Who visits
- Hardware engineers
- Supply chain managers
- Product development specialists
Tokyo remains a primary center for advanced electronics R&D and manufacturing, acting as a critical node for global printed circuit board technology supply chains. Professionals often analyze these regional shifts to anticipate upcoming standards in material efficiency and circuit integration.
Reviewed: October 27, 2026
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Sources
All sources are official exhibition or organizer references.
Last checked: October 27, 2026