국제인증전시회 국제 반도체 기판 및 첨단 패키징 산업전
Exhibition Overview
Floor Plan & Exhibitors
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Why Attend
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Based on verified event data
- Event: 국제인증전시회 국제 반도체 기판 및 첨단 패키징 산업전
- Edition year: 2026
- Dates: 2026-09-09 to 2026-09-11
- Location: Incheon, South Korea
- Venue: 송도컨벤시아 (Songdo ConvensiA)
- Organizer: (사)한국PCB&반도체패키징산업협회, 인천광역시
- Official website: https://www.kpcashow.com
- Verification: verified
This edition has already concluded; the analysis below is retained for reference.
The 2026 edition facilitated direct engagement between semiconductor substrate manufacturers and industry stakeholders within the strategic hub of Incheon.
The event highlighted the latest advancements in high-density interconnection and packaging technologies as presented by the Korea PCB and Semiconductor Packaging Industry Association.
Participants gained retrospective insights into the regional supply chain dynamics supported by the collaborative efforts of the Incheon Metropolitan City government.
Opportunity types
Who exhibits
- PCB manufacturers
- Semiconductor packaging firms
- Substrate material suppliers
Who visits
- Industrial buyers
- Supply chain analysts
- Manufacturing engineers
Incheon, specifically the Songdo area, has increasingly positioned itself as a critical node in South Korea's high-tech manufacturing ecosystem. The growing demand for advanced semiconductor packaging is driving regional infrastructure investments and tightening the integration between localized manufacturing and global distribution networks.
Reviewed: October 29, 2026
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Sources
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